XC6SLX4-3FTG256I

XC6SLX4-3FTG256I - Xilinx
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Краткое описание: FPGA 3840 Cells 45nm 256-Pin FTBGA, 186 I/Os, 216K RAM

Дополнительная информация

Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers, built on 45nm process technology. Features 216 Kbit RAM, 16 integrated 18x18 multipliers, and 8 dedicated DSP blocks. Offers 186 maximum user I/Os and 6 DLLs/PLLs. Operates with a transceiver speed of 3.2 Gbps and utilizes SRAM for program memory. Packaged in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) with a 1mm pin pitch, suitable for surface mounting. Extended operating temperature range from -40 °C to 100 °C.
PCB 256
ECCN EAR99
PPAP No
Jedec MS-034AAF-1
EU RoHS Yes
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 216Kbit
Cage Code 68994
Pin Count 256
Automotive No
Lead Shape Ball
Schedule B 8542390000
Family Name Spartan®-6 LX
Speed Grade 3
Package/Case FTBGA
AEC Qualified No
Dedicated DSP 8
RoHS Versions 2011/65/EU
Pin Pitch (mm) 1
Programmability Yes
Package Material Plastic
Transceiver Speed 3.2Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 3840
Package Width (mm) 17
Process Technology 45nm
Number of Registers 4800
Package Description Fine Pitch Thin Ball Grid Array
Package Family Name BGA
Package Height (mm) 1
Package Length (mm) 17
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 16 (18x18)
Seated Plane Height (mm) 1.4
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Total Number of Block RAM 12
Device Number of DLLs/PLLs 6
Maximum Number of User I/Os 186

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