XC6SLX4-L1FT256I
Увеличить
Краткое описание:
FPGA 3840 Cells 45nm 256-Pin FTBGA, 186 I/O, 216K RAM
Дополнительная информация
Field Programmable Gate Array (FPGA) with 3840 logic cells and 45nm process technology. Features 4800 registers, 216 Kbit RAM, and 12 block RAMs. Includes 8 dedicated DSP slices and 16 multipliers (18x18). Operates with a transceiver speed of 3.2 Gbps. Packaged in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) with a 17mm x 17mm footprint, suitable for surface mounting. Offers a minimum operating temperature of -40 °C and a maximum of 100 °C.
| PCB | 256 |
| ECCN | EAR99 |
| PPAP | No |
| Jedec | MS-034AAF-1 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 216Kbit |
| Cage Code | 68994 |
| Pin Count | 256 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 1L |
| Package/Case | FTBGA |
| AEC Qualified | No |
| Dedicated DSP | 8 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 3840 |
| Package Width (mm) | 17 |
| Process Technology | 45nm |
| Number of Registers | 4800 |
| Package Description | Fine Pitch Thin Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1 |
| Package Length (mm) | 17 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 16 (18x18) |
| Seated Plane Height (mm) | 1.4 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 12 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 186 |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
