XC6SLX45-3FG900C
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Краткое описание:
FPGA 43661 LC, 900-Pin FBGA, 45nm, 3.2Gbps Transceiver
Дополнительная информация
Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. Features 2,088 Kbit RAM, 116 (18x18) multipliers, and 58 dedicated DSP blocks. Offers 576 maximum user I/Os and 12 DLLs/PLLs. Operates at 1.2V with transceiver speeds up to 3.2 Gbps. Packaged in a 900-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with dimensions of 31mm x 31mm x 1.75mm.
| PCB | 900 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 2088Kbit |
| Cage Code | 68994 |
| Pin Count | 900 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 3 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 58 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 43661 |
| Package Width (mm) | 31 |
| Process Technology | 45nm |
| Number of Registers | 54576 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.75 |
| Package Length (mm) | 31 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 116 (18x18) |
| Seated Plane Height (mm) | 2.25 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 116 |
| Device Number of DLLs/PLLs | 12 |
| Maximum Number of User I/Os | 576 |
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