XC6SLX45T-2FG676C

XC6SLX45T-2FG676C - Xilinx
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Краткое описание: FPGA 43661 LC 45nm 676-Pin FBGA 3.2Gbps Transceiver

Дополнительная информация

Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. Features 2,088 Kbit RAM, 116 (18x18) multipliers, and 58 dedicated DSP slices. Offers 4 transceiver blocks operating at 3.2 Gbps, 1 PCI block, and 12 DLLs/PLLs. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a 1mm pin pitch and dimensions of 27mm x 27mm x 1.73mm. Operates within a temperature range of 0°C to 85°C.
PCB 676
ECCN 3A991.d
PPAP No
Jedec MS-034AAL-1
EU RoHS No
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 2088Kbit
Cage Code 68994
Pin Count 676
Automotive No
Lead Shape Ball
PCI Blocks 1
Schedule B 8542390000
Family Name Spartan®-6 LXT
Speed Grade 2
Package/Case FBGA
AEC Qualified No
Dedicated DSP 58
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 1
Programmability Yes
Package Material Plastic
Transceiver Speed 3.2Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 43661
Package Width (mm) 27
Process Technology 45nm
Transceiver Blocks 4
Number of Registers 54576
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Package Height (mm) 1.73
Package Length (mm) 27
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 116 (18x18)
Seated Plane Height (mm) 2.23
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Total Number of Block RAM 116
Device Number of DLLs/PLLs 12
Maximum Number of User I/Os 498

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