XC6SLX45T-3FGG900I
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Краткое описание:
FPGA 45nm 900-Pin FBGA 43661 Cells 3.2Gbps Transceiver
Дополнительная информация
Field Programmable Gate Array (FPGA) featuring 43,661 logic cells and 54,576 registers. This device utilizes 45nm process technology, offers 2,088 Kbit of RAM, and includes 116 18x18 multipliers and 58 dedicated DSP blocks. It supports up to 576 user I/Os, four transceiver blocks operating at 3.2 Gbps, and one PCI block. Packaged in a 900-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, this component operates within a temperature range of -40°C to 100°C.
| PCB | 900 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 2088Kbit |
| Cage Code | 68994 |
| Pin Count | 900 |
| Automotive | No |
| Lead Shape | Ball |
| PCI Blocks | 1 |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LXT |
| Speed Grade | 3 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 58 |
| RoHS Versions | 2011/65/EU |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 43661 |
| Package Width (mm) | 31 |
| Process Technology | 45nm |
| Transceiver Blocks | 4 |
| Number of Registers | 54576 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.75 |
| Package Length (mm) | 31 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 116 (18x18) |
| Seated Plane Height (mm) | 2.25 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 116 |
| Device Number of DLLs/PLLs | 12 |
| Maximum Number of User I/Os | 576 |
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