XC6SLX75-2FGG676C
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Краткое описание:
FPGA 74.6K Logic Cells, 408 I/Os, 3.2Gbps Transceiver, 45nm, 676-FBGA
Дополнительная информация
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3,096 Kbit of RAM, 132 dedicated DSP blocks with 18x18 multipliers, and 172 total Block RAMs. Offers 408 maximum user I/Os and a transceiver speed of 3.2 Gbps. Housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package measuring 27x27mm with a 1mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
| PCB | 676 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034AAL-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 3096Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 2 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 132 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 74637 |
| Package Width (mm) | 27 |
| Process Technology | 45nm |
| Number of Registers | 93296 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.73 |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 132 (18x18) |
| Seated Plane Height (mm) | 2.23 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 172 |
| Device Number of DLLs/PLLs | 18 |
| Maximum Number of User I/Os | 408 |
