XC6SLX75-3FG900C
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Краткое описание:
FPGA 74.6K Cells 900-Pin FBGA 45nm 3.2Gbps
Дополнительная информация
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3096 Kbit RAM, 132 dedicated DSP slices, and 172 block RAMs. Offers 576 maximum user I/Os and 264 (18x18) multipliers. Operates at 1.2V with transceiver speeds up to 3.2 Gbps. Packaged in a 900-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with dimensions of 31mm x 31mm x 1.75mm.
| PCB | 900 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 3096Kbit |
| Cage Code | 68994 |
| Pin Count | 900 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 3 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 132 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 74637 |
| Package Width (mm) | 31 |
| Process Technology | 45nm |
| Number of Registers | 93296 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.75 |
| Package Length (mm) | 31 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 264 (18x18) |
| Seated Plane Height (mm) | 2.25 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 172 |
| Device Number of DLLs/PLLs | 18 |
| Maximum Number of User I/Os | 576 |
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