XC6SLX75-L1FGG900I
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Краткое описание:
FPGA Spartan-6 LX 74.6K Cells 45nm 900-Pin FBGA 3.2Gbps
Дополнительная информация
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3096 Kbit RAM bits, 132 dedicated DSP slices, and 264 18x18 multipliers. Offers 576 maximum user I/Os and 18 DLLs/PLLs. This surface-mount device is housed in a 900-pin Fine Pitch Ball Grid Array (FBGA) package measuring 31x31x1.75mm with a 1mm pin pitch, operating within a -40°C to 100°C temperature range.
| PCB | 900 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 3096Kbit |
| Cage Code | 68994 |
| Pin Count | 900 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 1L |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 132 |
| RoHS Versions | 2011/65/EU |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 74637 |
| Package Width (mm) | 31 |
| Process Technology | 45nm |
| Number of Registers | 93296 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.75 |
| Package Length (mm) | 31 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 264 (18x18) |
| Seated Plane Height (mm) | 2.25 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 172 |
| Device Number of DLLs/PLLs | 18 |
| Maximum Number of User I/Os | 576 |
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