XC6SLX75T-2FGG900C

XC6SLX75T-2FGG900C - Xilinx
Краткое описание: FPGA 74.6K Cells 45nm 900-Pin FBGA 3.2Gbps Transceiver

Дополнительная информация

Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3096 Kbit RAM bits, 172 block RAMs, and 132 dedicated DSP slices. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Offered in a 900-pin Fine Pitch Ball Grid Array (FBGA) package for surface mounting, with a maximum of 576 user I/Os. Operates within a temperature range of 0°C to 85°C.
PCB 900
ECCN 3A991.d
PPAP No
Jedec MS-034
EU RoHS Yes
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 3096Kbit
Cage Code 68994
Pin Count 900
Automotive No
Lead Shape Ball
PCI Blocks 1
Schedule B 8542390000
Family Name Spartan®-6 LXT
Speed Grade 2
Package/Case FBGA
AEC Qualified No
Dedicated DSP 132
RoHS Versions 2011/65/EU
Pin Pitch (mm) 1
Programmability Yes
Package Material Plastic
Transceiver Speed 3.2Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 74637
Package Width (mm) 31
Process Technology 45nm
Transceiver Blocks 8
Number of Registers 93296
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Package Height (mm) 1.75
Package Length (mm) 31
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 264 (18x18)
Seated Plane Height (mm) 2.25
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Total Number of Block RAM 172
Device Number of DLLs/PLLs 18
Maximum Number of User I/Os 576

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