XC6SLX75T-4FG900C

Снят с производства
XC6SLX75T-4FG900C - Xilinx
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Краткое описание: FPGA 74.6K Logic Cells 45nm 900-Pin FBGA 3.2Gbps Transceiver
Производитель Xilinx
Статус производства Снят с производства (OBSOLETE)

Дополнительная информация

High-performance Field Programmable Gate Array (FPGA) featuring 74,637 logic cells and 93,296 registers. This device offers 3096 Kbit of RAM, 264 integrated 18x18 multipliers, and 132 dedicated DSP blocks. It includes 8 transceiver blocks operating at up to 3.2 Gbps and a PCI block. The FPGA is built on 45nm process technology, operates at 1.2V, and is housed in a 900-pin, 31mm x 31mm Fine Pitch Ball Grid Array (FBGA) package for surface mounting.
PCB 900
ECCN 3A991.d
PPAP No
Jedec MS-034
EU RoHS No
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 3096Kbit
Cage Code 68994
Pin Count 900
Automotive No
Lead Shape Ball
PCI Blocks 1
Schedule B 8542390000
Family Name Spartan®-6 LXT
Speed Grade 4
Package/Case FBGA
AEC Qualified No
Dedicated DSP 132
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 1
Programmability Yes
Package Material Plastic
Transceiver Speed 3.2Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 74637
Package Width (mm) 31
Process Technology 45nm
Transceiver Blocks 8
Number of Registers 93296
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Package Height (mm) 1.75
Package Length (mm) 31
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 264 (18x18)
Seated Plane Height (mm) 2.25
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Total Number of Block RAM 172
Device Number of DLLs/PLLs 18
Maximum Number of User I/Os 576

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