XC6SLX9-L1FGG484I
Увеличить
Краткое описание:
FPGA Spartan-6 LX 9152 Cells 45nm 3.2Gbps 484-Pin FBGA
Дополнительная информация
Field Programmable Gate Array (FPGA) with 9152 logic cells and 11440 registers, built on 45nm process technology. Features 576 Kbit RAM, 32 (18x18) multipliers, and 16 dedicated DSP blocks. Offers 338 maximum user I/Os and 3.2 Gbps transceiver speed. Packaged in a 484-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a 1mm pin pitch and dimensions of 23mm x 23mm x 1.7mm. Operates across a temperature range of -40°C to 100°C.
| PCB | 484 |
| ECCN | 3A991.d |
| PPAP | No |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 576Kbit |
| Cage Code | 68994 |
| Pin Count | 484 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 1L |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 16 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 9152 |
| Package Width (mm) | 23 |
| Process Technology | 45nm |
| Number of Registers | 11440 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.7 |
| Package Length (mm) | 23 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 32 (18x18) |
| Seated Plane Height (mm) | 2.2 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 32 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 338 |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
